Case Studies

ASIC

Case Study: ASIC Design Techniques for Multi-Processor System-on-Chip (MPSoC) Development

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Case Study: ASIC Design Techniques for Multi-Processor System-on-Chip (MPSoC) Development Today, with the advancement of technology at such a rapid pace, numerous applications need faster and more power-efficient systems. Among them, Multi-Processor System-on-Chip (MPSoC) is one of the principal architectures existing in fields from mobile devices to high-performance computing and automotive systems. The design of […]

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Semiconductor Manufacturing

Adapting to Change – Exploring the Challenges and Opportunities in Semiconductor Manufacturing for the Next Decade

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Adapting to Change – Exploring the Challenges and Opportunities in Semiconductor Manufacturing for the Next Decade Introduction The semiconductor chip production process has played an accelerator role in technology innovation within consumer electronics, telecommunication, automobile, and the defence industries. Such requirements in life being digitized are becoming increasingly energetic and power-intensive, which continue to pose

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ASIC DESIGN FLOW

Case Study: Transforming Product Development with ASIC Design Expertise

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Case Study: Transforming Product Development with ASIC Design Expertise Application-Specific Integrated Circuits, or ASIC, refers to special semiconductor chips carefully designed for a particular use or application. In contrast to general-purpose chips, which are integrated in a way that they can handle a variety of tasks, ASICs are specially built for maximum performance and efficiency

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PCB Design Innovations

PCB Design Innovations: Case Studies on Best Practices and Future Applications

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PCB Design Innovations: Case Studies on Best Practices and Future Applications Printed Circuit Boards form the heart of modern electronics. Used in every aspect of technological applications, right from medical devices to smartphones, cars, and self-driving, PCBs have grown the need for more advanced PCB designs to achieve the stringent requirements of power, efficiency, and

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Electronic components

Case Study: Strategic Product Design – Overcoming Challenges of Strained Electronic Component Lead Times

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Case Study: Strategic Product Design – Overcoming Challenges of Strained Electronic Component Lead Times Electronic components are one of the greatest challenges for product designers, manufacturers, and procurement teams in the fast-changing world of electronics. Increasing demand for electronic devices, coupled with the disruption of the pandemic in supply chains, has raised this challenge. Component

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ASIC Design

ASIC Design Unveiled: A Detailed Guide to Development Services and Industry Practices

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ASIC Design Unveiled: A Detailed Guide to Development Services and Industry Practices The semiconductor industry is constantly evolving, mainly making trends with new applications and electronic devices. One of the keys that has contributed to innovation in the ASIC range is an Application-Specific Integrated Circuit. Essentially, ASICs are chips for a particular application, created and

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Semiconductor Chip Design

Selecting the Right Partner: Key Factors in Choosing a Semiconductor Chip Design Services Provider

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Selecting the Right Partner: Key Factors in Choosing a Semiconductor Chip Design Services Provider Introduction A unique semiconductor device can play a significant role in differentiating a product line from rivals. It can tell us whether a product will succeed or fail in capturing market share. Nevertheless, creating such a device can come with prohibitive

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ASIC vs FPGA

ASIC vs FPGA: Case Studies on Prototyping, Design, and Implementation

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ASIC vs FPGA: Case Studies on Prototyping, Design, and Implementation In this fast-moving world of electronics and embedded systems, it’s time to face one critical decision: ASIC or FPGA? This choice can heavily affect the development cycle, cost, performance, and scalability of the project. We will describe the pros and cons of each technology along

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MEMS CMOS Integration

MEMS CMOS Integration for Disease Detection using a Multi-Sensor Sub-System

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MEMS CMOS Integration for Disease Detection using a Multi-Sensor Sub-System Problem Statement/Challenges: Early detection of chronic and infectious diseases is an open problem for humanity. The search for non-invasive techniques is the need of the hour. CMOS-compatible solutions are the future for finding a cost-effective home device. MEMs (Micro-electro-mechanical systems)-CMOS integrated systems have been conceptualised.

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Low Powe Design

Low Power VLSI Design For Home Automation And Security System

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Problem Statement/Challenges: Our client, a leading home automation company, required a highly efficient, lowpower VLSI design to integrate into their new line of smart home security systems. Their goal was to enhance the energy efficiency of their products without compromising performance or security. The primary challenges included: High-Level Solution: We proposed a VLSI design leveraging

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