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Adapting to Change – Exploring the Challenges and Opportunities in Semiconductor Manufacturing for the Next Decade

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Adapting to Change – Exploring the Challenges and Opportunities in Semiconductor Manufacturing for the Next Decade Introduction The semiconductor chip production process has played an accelerator role in technology innovation within consumer electronics, telecommunication, automobile, and the defence industries. Such requirements in life being digitized are becoming increasingly energetic and power-intensive, which continue to pose […]

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Case Study: Transforming Product Development with ASIC Design Expertise

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Case Study: Transforming Product Development with ASIC Design Expertise Application-Specific Integrated Circuits, or ASIC, refers to special semiconductor chips carefully designed for a particular use or application. In contrast to general-purpose chips, which are integrated in a way that they can handle a variety of tasks, ASICs are specially built for maximum performance and efficiency

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Case Study: Strategic Product Design – Overcoming Challenges of Strained Electronic Component Lead Times

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Case Study: Strategic Product Design – Overcoming Challenges of Strained Electronic Component Lead Times Electronic components are one of the greatest challenges for product designers, manufacturers, and procurement teams in the fast-changing world of electronics. Increasing demand for electronic devices, coupled with the disruption of the pandemic in supply chains, has raised this challenge. Component

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ASIC Design Unveiled: A Detailed Guide to Development Services and Industry Practices

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ASIC Design Unveiled: A Detailed Guide to Development Services and Industry Practices The semiconductor industry is constantly evolving, mainly making trends with new applications and electronic devices. One of the keys that has contributed to innovation in the ASIC range is an Application-Specific Integrated Circuit. Essentially, ASICs are chips for a particular application, created and

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ASIC vs FPGA: Case Studies on Prototyping, Design, and Implementation

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ASIC vs FPGA: Case Studies on Prototyping, Design, and Implementation In this fast-moving world of electronics and embedded systems, it’s time to face one critical decision: ASIC or FPGA? This choice can heavily affect the development cycle, cost, performance, and scalability of the project. We will describe the pros and cons of each technology along

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MEMS CMOS Integration for Disease Detection using a Multi-Sensor Sub-System

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MEMS CMOS Integration for Disease Detection using a Multi-Sensor Sub-System Problem Statement/Challenges: Early detection of chronic and infectious diseases is an open problem for humanity. The search for non-invasive techniques is the need of the hour. CMOS-compatible solutions are the future for finding a cost-effective home device. MEMs (Micro-electro-mechanical systems)-CMOS integrated systems have been conceptualised.

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Meeting The Semiconductor Demands In The Evolution Of Automotive Technology

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Problem Statement/Challenges: The automotive industry is undergoing a radical transformation, shifting frominternal combustion engines (ICE) to electric and autonomous vehicles. This evolution requires a significant increase in semiconductor content—twice for electric vehicles and eight times for autonomous vehicles. Meeting these demands necessitates innovative ASIC designs to integrate advanced semiconductor functionalities seamlessly into next-generation vehicles. High-Level

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