Meeting The Semiconductor Demands In The Evolution Of Automotive Technology

case study meeting semiconductor

meeting semiconductor

Problem Statement/Challenges:

The automotive industry is undergoing a radical transformation, shifting frominternal combustion engines (ICE) to electric and autonomous vehicles. This evolution requires a significant increase in semiconductor content—twice for electric vehicles and eight times for autonomous vehicles. Meeting these demands necessitates innovative ASIC designs to integrate advanced semiconductor functionalities seamlessly into next-generation vehicles.

  1. Ensuring compliance with strict medical standards and certifications (FDA, CE, BIS).
  2. Meeting specific technical requirements for each device, such as high-resolution imaging and rapid processing capabilities.
  3. Operating under varying environmental conditions while maintaining performance.
  4. Reducing power consumption and enhancing device efficiency.
  5. Accelerating time-to-market for competitive advantages.

High-Level Solution:

Our company provided a complete turnkey ASIC design solution to address the
growing semiconductor needs of electric and autonomous vehicles. Our
comprehensive service included:

  1. Initial architecture design
  2. RTL design
  3. Verification
  4. Physical design
  5. Final GDSII stream-out

To ensure the highest quality and performance, we partnered with industry leaderssuch as Synopsys and Cadence for top-tier design tools and TSMC for advancedfabrication processes. This collaboration allowed us to deliver world-class products
and provide a one-stop platform for all client needs, from consultation andgathering specification requirements to delivering core products that performconsistently in real-world conditions.

Design Quality:

The design process focused on creating high-quality, robust ASICs capable of withstanding the rigorous demands of automotive environments. Key aspects included:

  1. Performance Optimization: Leveraging cutting-edge technologies to maximize processing power and efficiency.
  2. Reliability and Safety: Ensuring adherence to automotive industry standards for
    safety-critical applications.
  3. Scalability: Designing flexible solutions to accommodate future advancements and
    additional functionalities.

Pre-Silicon Testing:

Our pre-silicon testing phase involved comprehensive verification methodologies to validate the ASIC designs before fabrication. This phase included:

  1. Functional Verification: Using advanced simulation techniques to ensure the design met all specified requirements.
  2. Timing Analysis: Verifying that the design operated correctly within the required timing constraints.
  3. Power Analysis: Ensuring the design met power consumption targets critical for automotive applications.

Prototype Testing:

Following successful pre-silicon testing, prototype ASICs were fabricated and subjected to rigorous testing protocols, including:

  1. Bench Testing: Conducting detailed performance and functionality tests in controlled environments.
  2. Environmental Testing: Exposing prototypes to various temperature and stress conditions to verify reliability and durability.
  3. System Integration Testing: Ensuring seamless integration with other vehicle systems and components.

Client Testing:

After thorough prototype validation, the final ASICs were delivered for in-vehicle testing. This phase included

  1. Field Testing: Evaluating the performance of the ASICs in real-world driving conditions.
  2. Feedback Loop: Gathering feedback and making necessary adjustments to ensure optimal performance and satisfaction.
  3. Certification: Assisting in obtaining necessary certifications and compliance with the automotive industry standards.

Conclusion:

Our turnkey ASIC design solution enabled the successful integration of advanced semiconductor functionalities into next-generation vehicles, positioning automotive manufacturers at the forefront of innovation. The custom ASICs delivered superior performance, reliability, and scalability, meeting the demanding requirements ofmodern electric and autonomous vehicles. This collaboration, supported by global partners like Synopsys, Cadence, and TSMC, not only enhanced the offering of semiconductor companies but also contributed to the ongoing transformation of the automotive industry towards more intelligent, connected, and electrified vehicles.